Printed circuit board (PCB) fabrication continues pushing the boundaries of density and performance. Two leading-edge technologies gaining adoption are 10 oz copper layers to manage high currents as well as centralized design databases harnessing ECAD data across large organizations. However, companies embracing these techniques must reconcile migration challenges moving high-density layout libraries built for standard 1-2 oz copper to thicker stackups.
This article explores considerations when migrating PCB design data to support advancing substrate technologies. We’ll cover:
- Benefits and applications driving adoption of 10 oz copper boards
- Library data migration challenges arising from greater copper thickness
- Risk mitigation through DFM analysis and layout standards
- Database tools to automate revision control and release management
Let’s explore how enterprises unlock future-forward circuit density without compromising design database integrity.
Why Adopt 10 Ounce Copper?
Traditional PCB layer stacks utilize 1 ounce copper foils, equivalent to around 35 microns thickness. Some boards specify 2 oz in high current regions. However, designs with extreme power demands now migrate to 10 oz copper (350 μm) for superior current handling capacity thanks to lower resistivity losses.
Applications benefiting from thick copper boards include:
High power electronics – Electric vehicle inverter modules, industrial motor drives, solar combiners
Computing systems – Server bus planes (12V or 48V), network switch hardware
Power conversion – High current AC-DC rectifiers and DC-DC converters
Battery energy storage – Battery management electronics exposed to heavy discharge loads
Thick copper renders lower current densities plus reduced thermal rise from joule heating, minimizing electromigration risks. This extends reliable lifetimes for heavy amperage applications.
While 10 oz copper transports extreme currents with lower losses, greater metal thickness does impact design practices. Next we’ll cover resulting library migration considerations.
Challenges Transitioning PCB Library Data to Thick Copper
Migrating existing circuit architectures optimized for 1-2 oz copper to thicker 10 oz stackups triggers extensive design adjustments:
Altered trace/space tolerances – 10x increased copper thickness shrinks fabrication tolerance windows for achieving trace width and clearance targets. Constraints get tighter.
Changed current capacity calculations – Assumed ampacities and fuse sizing logic requires recalculation based on enhanced 10 oz thickness. Libraries need updated ratings.
Modified plane connections – Connecting multilayer boards through thicker power or ground planes requires adjusting via placement and capture pad dimensions.
New DFM rule checks – Existing design for manufacturing checks often assume 1 oz copper constraints. More restrictive spacing and higher aspect ratio rules must get added.
Iterative validation – Each adjustment intended to migrate libraries from thin to thick substrates will demand engineering verification, simulated testing, and potential further modifications upon initial release. Designers should model proper current flow, thermal gradients and mechanical integrity.
While disruptive in the near-term, overcoming these hurdles unlocks decades of reliable service life supporting sustained high current capacity 10x beyond conventional boards.
Proactive mitigation techniques help smooth library transitions. Let’s explore recommendations.
Streamlining Thick Copper Library Migrations
Attempting wholesale transitions from legacy thin copper libraries to next-gen thicker constructions will introduce extensive validation needs slowing releases. Instead, enterprises should take gradual steps:
Stage a pilot subset - Limit initial 10 oz board adoptions to a controlled collection of layouts. Coordinate constructs between electrical, mechanical, and PCB designers to mitigate integration surprises before expanding further.
Parameterize custom properties – Embed copper construction variables like finished thickness, fabrication tolerances, and via dimensions into library components for easy tweaking through automation scripts or database backplane as specs evolve.
Run expanded DFM checks – Execute extensive new design rule checks tailored to thick copper constraints spanning trace geometries, spacing, mask expansion and higher aspect ratio holes. Perform thermal simulation on power planes.
Map release gates – Structure library migrations into multiple managed phases based on complexity to control revisions flowing to production. Simple low-risk fixes release first. Higher-risk constructs requiring intense modeling and interdisciplinary checks get staged later.
While navigating the practical challenges of thick copper migration, structured data management unlocks additional protection.
Harness Design Database Power
To orchestrate such extensive modifications safely across numerous complex libraries intended for enterprise-wide reuse, design teams should leverage centralized design data management systems (DDMS).
Sophisticated PCB data management platforms like Upchain XDM allow version control over each element within relevant library packages updated for 10 oz builds. This grants abilities like:
- Associate model validation status to individual component and net revisions as they get verified for thick substrate integration
- Automate new DFM rules tailored to thick copper constraints on trace geometry and spacing
- Trigger release notifications based on project team workspaces when constructs reach approved maturity levels
- Simplify report generation on migration coverage rates to demonstrate progress towards thicker substrate adoption
DDMS tools facilitate organizing migration complexity across far-reaching product lines utilizing shared PCB library assets. Controlled release automation reduces human errors.
Conclusion
Migrating towards advanced thick copper designs promises substantial performance gains and reliability for high power systems – but at the cost of disruptive library data transitions.
By planning staged component migrations through pilot testing, embracing parameterization, expanding integration checks, and controlling revisions through design data management systems, engineering teams can adopt modern constructions smoothly without compromising production integrity.
Careful change integration unlocks a powerful technology trajectory for many years as substrate innovations continue advancing PCB capabilities.
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