5 Mistakes You Need To Avoid When Placing Your PCB Order

 In the fast-paced world of electronics manufacturing, ordering printed circuit boards (PCBs) is a critical step that can make or break your project's success. Whether you're a seasoned electronics engineer, a hobbyist working on your next creation, or a procurement manager handling bulk orders, mistakes during the PCB ordering process can lead to costly delays, performance issues, and even complete project failures.

This comprehensive guide delves into the five most common and devastating mistakes made when placing PCB orders and provides actionable strategies to avoid them. By understanding these pitfalls and implementing the recommended preventive measures, you'll streamline your PCB procurement process, reduce costs, and ensure your projects stay on schedule.

Let's dive into each of these critical mistakes and explore how to avoid them to ensure your PCB ordering process goes smoothly from start to finish.

Incomplete or Inaccurate Design Specifications

Perhaps the most fundamental mistake in PCB ordering is submitting designs with incomplete or inaccurate specifications. This seemingly simple oversight can cascade into numerous problems throughout the manufacturing process, leading to boards that fail to meet your requirements or, worse, don't function at all.

The Consequences of Incomplete Specifications

When your PCB specifications are incomplete or inaccurate, the repercussions can be severe and far-reaching:

• Manufacturing delays: The fabricator may need to pause production to request clarification, adding days or weeks to your timeline.
• Increased costs: Changes made after production has begun often incur significant charges, sometimes exceeding the initial order cost.
• Functionality issues: Boards may not perform as expected or fail completely when specifications are incorrect.
• Compatibility problems: Components might not fit properly, leading to assembly difficulties or unreliable connections.

Common Specification Oversights

Specification Element
Common Mistakes
Potential Consequences
Board Dimensions
Incorrect measurements or tolerances
Components won't fit, enclosure compatibility issues
Layer Stack-up
Unspecified impedance requirements, incorrect copper weight
Signal integrity problems, thermal management issues
Trace Width/Spacing
Insufficient width for current capacity, too tight spacing
Overheating traces, manufacturing defects, shorts
Drill Sizes
Improper hole-to-pad ratio, undersized holes
Component fitting issues, weak mechanical connections
Material Selection
Inappropriate substrate for the application
Thermal problems, premature board failure, signal loss
Surface Finish
Wrong finish for the soldering process or environment
Poor solderability, oxidation, reduced lifespan
Silkscreen/Legend
Missing polarity indicators, reference designators
Assembly errors, maintenance difficulties

How to Ensure Complete and Accurate Specifications

To avoid the pitfalls of incomplete specifications, implement these best practices:

Create a Comprehensive Design Requirements Document

Before starting your PCB design, develop a detailed requirements document that includes:

• Electrical requirements (voltage, current, impedance)
• Mechanical specifications (dimensions, mounting holes)
• Environmental considerations (temperature range, humidity, vibration)
• Regulatory compliance needs (UL, RoHS, ISO)
• Performance expectations (signal integrity, EMI/EMC)

Use a Specification Checklist

Develop and use a standardized checklist for every PCB order. This simple tool can drastically reduce specification errors. Your checklist should include:

1. Board basics: Dimensions, thickness, material type, and layer count
2. Electrical specifications: Copper weight, impedance requirements, voltage ratings
3. Manufacturing details: Minimum trace width/spacing, drill sizes, via types
4. Finish requirements: Surface finish type, solder mask color, silkscreen specifications
5. Special requirements: Controlled impedance, blind/buried vias, edge plating

Collaborate with Your Manufacturer Early

Engaging with your PCB manufacturer during the design phase rather than after completion can help identify potential issues before they become problems:

• Share preliminary designs for design for manufacturability (DFM) feedback
• Discuss specific capabilities and limitations of the manufacturer's equipment
• Confirm material availability and lead times
• Clarify any specialized requirements or unique features

Use Standardized Design Rules

Implementing standardized design rules in your PCB design software that align with your manufacturer's capabilities ensures your design remains within manufacturable parameters:

• Set minimum trace width and spacing based on manufacturer capabilities
• Configure appropriate drill size ranges
• Establish clearance rules for different voltage levels
• Define via parameters according to manufacturer specifications

Case Study: The Cost of Specification Errors

A telecommunications company once submitted a PCB order for a new router product without specifying the required impedance control for high-speed signal traces. The resulting boards functioned inconsistently, with some units experiencing significant signal integrity issues. The company had to:

1. Identify the root cause through extensive testing
2. Redesign the board with proper impedance specifications
3. Re-order 10,000 units at an additional cost of $85,000
4. Delay product launch by three months, resulting in lost market opportunity

This costly mistake could have been avoided with proper specification documentation and review before order placement.

Overlooking Manufacturing Capabilities and Limitations

A critical mistake many engineers and procurement professionals make is failing to align their PCB design with the specific capabilities and limitations of their chosen manufacturer. Each PCB fabricator has different equipment, processes, and specializations, making it essential to understand these parameters before finalizing your design.

Understanding Manufacturer Capabilities

PCB manufacturers vary widely in their technological capabilities, which directly impacts what they can produce reliably and cost-effectively:

Technology Levels and Their Implications

Technology Level
Typical Capabilities
Best For
Limitations
Standard
• 6-8 layers<br>• 5 mil traces/spaces<br>• 10 mil drill size<br>• ±10% impedance tolerance
• Consumer electronics<br>• Industrial controls<br>• Low-speed applications
• Limited for high-density designs<br>• Not suitable for high-frequency
Advanced
• 12-16 layers<br>• 3-4 mil traces/spaces<br>• 8 mil drill size<br>• ±5% impedance tolerance
• Telecommunications<br>• Medical devices<br>• Medium-complexity designs
• Higher cost<br>• Limited availability
High-Tech
• 20+ layers<br>• <3 mil traces/spaces<br>• Laser drilling capability<br>• ±3% impedance tolerance
• Military/aerospace<br>• High-frequency RF<br>• High-density computing
• Significantly higher cost<br>• Longer lead times<br>• Limited suppliers

Common Manufacturing Limitation Oversights

When designers fail to consider manufacturing limitations, several issues can arise:

Design Elements That Commonly Exceed Manufacturing Capabilities

1. Aspect ratio violations: The ratio between board thickness and hole diameter often has strict limits, typically 10:1 or 8:1. When exceeded, it leads to drilling problems, poor plating, and unreliable connections.
2. Copper balancing issues: Uneven copper distribution across layers can cause warping during manufacturing. Many designers neglect to implement proper copper balancing techniques like adding copper pours or hatched ground planes.
3. Extremely tight tolerances: Specifying tolerances beyond what's reasonably achievable increases costs and rejection rates. For example, demanding ±1% impedance control when the manufacturer's standard is ±10% may be impossible or prohibitively expensive.
4. Special material availability: Exotic or specialized materials may not be readily available or require minimum order quantities that exceed your needs, leading to delays or increased costs.
5. Complex board shapes and cutouts: Intricate board outlines or internal cutouts may require specialized routing equipment that not all manufacturers possess.

How to Align Design with Manufacturing Capabilities

To avoid the pitfalls of mismatched designs and manufacturing capabilities:

Research and Compare Manufacturer Capabilities

Before finalizing your design:

• Review manufacturer capability statements or design guides
• Request capability matrices that detail minimum/maximum specifications
• Discuss any special requirements directly with the manufacturer's engineering team
• Consider ordering capability test boards for new or critical designs

Design with Manufacturing in Mind (DFM)

Design for Manufacturability is a critical approach that considers production requirements during the design phase:

1. Adhere to standard material thicknesses (e.g., 0.062", 0.093") when possible
2. Use standard drill sizes rather than arbitrary dimensions
3. Maintain consistent spacing between features for more reliable production
4. Include manufacturing notes for any special requirements or critical dimensions
5. Add test points and fiducials for easier testing and assembly

Utilize DFM Analysis Tools

Modern PCB design software often includes DFM analysis tools that can identify potential manufacturing issues before submission:

• Run DFM checks as part of your design verification process
• Address any flagged issues or document them as acceptable risks
• Review DFM reports with your manufacturer if uncertain about specific warnings

Build Manufacturing Experience Through Feedback

After each PCB order:

• Request manufacturing feedback from your fabricator
• Document any issues encountered for future reference
• Update your design rules based on real-world production experiences
• Create a knowledge base of manufacturing constraints specific to your regular suppliers

Real-World Example: Manufacturing Capability Mismatch

A startup developing a compact IoT device designed their PCB with 3 mil traces and spaces throughout, based on capabilities advertised by their chosen manufacturer. However, they failed to notice that these tolerances were only achievable on the manufacturer's premium production line, which required minimum orders of 500 units. The startup, needing only 50 prototypes, faced three unappealing options:

1. Pay for 500 boards (10x their actual need)
2. Redesign the board with 5 mil tolerances for the standard production line
3. Find a new manufacturer willing to produce small quantities with tight tolerances at higher unit costs

They ultimately chose to redesign, losing two weeks of development time and incurring additional engineering costs.

Poor File Preparation and Documentation

The third major mistake in PCB ordering involves inadequate preparation and documentation of design files. Even the most perfectly designed PCB can fail in production if the files provided to the manufacturer are incorrect, incomplete, or poorly organized.

The Critical Files Package

A complete PCB manufacturing package typically includes several essential files that communicate different aspects of your design to the fabricator:

Essential PCB Manufacturing Files

File Type
Purpose
Common Formats
Critical Elements
Gerber Files
Define copper layers, soldermask, silkscreen
RS-274X
Layer alignment, aperture definitions
Drill Files
Specify hole locations and sizes
Excellon
Tool definitions, coordinates
Fabrication Drawing
Communicate board specs and special requirements
PDF/DXF
Stack-up, dimensions, notes
BOM (Bill of Materials)
List all components for assembly
Excel/CSV
Part numbers, quantities, references
Pick and Place File
Define component locations for automated assembly
CSV/TXT
X-Y coordinates, rotation data
Assembly Drawing
Guide manual or automated component placement
PDF
Component orientations, special notes
IPC-D-356
Electrical test specifications
D-356
Net information for testing

Common File Preparation Mistakes

Many PCB ordering issues stem from poorly prepared files:

File Generation Errors

1. Incorrect Gerber format settings: Using outdated formats or incorrect settings can result in missing features or distorted geometry.
2. Missing or duplicate layers: Forgetting to include certain layers (like internal planes) or accidentally including the same layer twice leads to manufacturing confusion.
3. Drill file mismatches: When drill files don't match the holes shown in Gerber files, manufacturers must either make assumptions or delay production to request clarification.
4. Inconsistent units: Mixing imperial and metric units across different files creates dimensional discrepancies.
5. Incomplete layer stack-up information: Failing to specify the precise arrangement of layers, their thicknesses, and materials results in boards that don't meet electrical or mechanical requirements.

Documentation Deficiencies

Incomplete documentation forces manufacturers to make assumptions, leading to potential errors:

1. Missing or vague fabrication notes: Without clear notes regarding special requirements, manufacturers default to standard processes that may not suit your design.
2. Conflicting specifications: When different documents contain contradictory information (e.g., different board thickness specified in the fabrication drawing versus the order form), production delays occur while clarification is sought.
3. Unstated design intent: Failing to communicate critical design requirements that aren't explicitly shown in the files (such as impedance control needs or specific clearance requirements).
4. Revision control problems: Submitting files from different revision levels creates an inconsistent manufacturing package.

Best Practices for File Preparation

To ensure your files are properly prepared for manufacturing:

Establish a Standardized Output Process

Create a documented, step-by-step procedure for generating manufacturing files:

1. Define standard output settings for your design software
2. Create templates for fabrication drawings with consistent formats
3. Implement a file naming convention that includes project name, revision, and date
4. Use a checklist to verify all required files are included

Implement Proper File Verification

Before submission, verify your files to catch potential issues:

1. Use Gerber viewers to visually inspect all layers and confirm they appear as expected
2. Cross-reference drill files with Gerber data to ensure alignment
3. Check for DRC (Design Rule Check) errors one final time
4. Verify net connectivity against your schematic
5. Review all text and dimensions for legibility and accuracy

Create Comprehensive Documentation

Thorough documentation eliminates guesswork:

1. Detailed fabrication drawings including:
   • Complete board dimensions with tolerances
   • Material specifications and stack-up details
   • Special process requirements (e.g., controlled impedance, special plating)
   • Critical areas requiring special attention
2. Assembly documentation including:
   • Component orientation references
   • Special assembly notes or procedures
   • Inspection criteria
3. Test specifications detailing:
   • Required electrical tests
   • Acceptable parameter ranges
   • Test point locations

Use Industry-Standard Formats and Protocols

Adhering to industry standards improves communication with manufacturers:

1. Use the latest Gerber format (typically RS-274X) rather than older variants
2. Follow IPC standards for documentation where applicable
3. Use consistent units throughout all files (preferably metric)
4. Include reference coordinates and fiducials

Example: The Impact of Proper File Preparation

An automotive electronics supplier learned the importance of proper file preparation after experiencing significant delays with a critical dashboard controller PCB. Their initial submission omitted layer stack-up details and had inconsistent information about controlled impedance requirements between the fabrication notes and design files.

The manufacturer halted production after partial completion when they discovered trace impedance issues during testing. The resulting investigation revealed that:

1. The PCB design required specific dielectric thicknesses to achieve the intended impedance values
2. This information was mentioned in an email but not included in the formal documentation
3. The Gerber files included outdated text notes from a previous revision

The supplier implemented a comprehensive file preparation protocol afterward, including:

• A mandatory peer review of all manufacturing packages
• Standardized templates for all documentation
• A final verification step using third-party Gerber viewers
• Explicit verification of impedance requirements with the manufacturer

This systematic approach eliminated similar errors in subsequent orders, reducing production delays by 40% and cutting rework costs by over $50,000 annually.

Inadequate Testing and Verification

The fourth major mistake in PCB ordering is failing to implement adequate testing and verification procedures. This oversight often results in discovering problems only after mass production, when corrections are most expensive and disruptive.

The Testing Hierarchy

Effective PCB verification follows a hierarchical approach, with each stage building on the previous:

PCB Testing Levels

Testing Level
What It Verifies
When to Perform
Common Methods
Design Verification
Design meets requirements on paper
Before ordering
DRC, ERC, simulation
Prototype Verification
Physical board functions as designed
With first articles
Manual testing, basic functionality
Electrical Verification
Circuit performance meets specifications
During development
Signal integrity, power integrity
Environmental Testing
Board reliability under stress
Pre-production
Temperature cycling, humidity, vibration
Production Testing
Manufacturing consistency
During production
ATE, ICT, flying probe
System Integration
Compatibility with other components
Integration phase
Functional testing in target system

Common Testing and Verification Mistakes

Many organizations underestimate the importance of thorough testing or implement it incorrectly:

Design Verification Oversights

1. Insufficient Design Rule Checking (DRC): Relying on basic DRC without customizing rules for specific design requirements leaves potential issues undetected.
2. Limited Electrical Rule Checking (ERC): Failing to verify electrical connectivity and compatibility between components can lead to fundamental circuit failures.
3. Inadequate Signal Integrity Analysis: For high-speed designs, skipping proper signal integrity simulation often results in performance issues that are difficult to diagnose later.
4. Bypassing Thermal Analysis: Overlooking thermal simulation for power-intensive designs can lead to overheating and reliability problems.

Prototype and Production Testing Gaps

1. Rushing Through Prototype Evaluation: Inadequate testing of prototype boards before approving production runs guarantees that any design issues will be multiplied across the entire batch.
2. Failing to Test Corner Cases: Testing only under ideal conditions rather than boundary conditions (voltage extremes, temperature limits, maximum load) leaves potential failure modes undiscovered.
3. Neglecting Test Point Accessibility: Insufficient test points or poorly placed access points make production testing difficult or impossible.
4. Relying Solely on Visual Inspection: While important, visual checks alone cannot detect electrical issues, impedance problems, or internal defects.

Comprehensive Testing Strategies

To ensure your PCBs perform as expected and are manufactured consistently:

Implement Thorough Pre-Production Verification

Before releasing your design for production:

1. Run comprehensive DRC with rules tailored to your specific requirements
2. Perform electrical simulations to verify circuit behavior
3. Conduct power distribution analysis to ensure adequate power delivery
4. Complete signal integrity simulations for high-speed signals
5. Verify component footprints against manufacturer datasheets

Design for Testability (DFT)

Make testing easier and more effective by incorporating testability features during design:

1. Add dedicated test points for critical signals
2. Implement boundary scan capability (JTAG) where appropriate
3. Design in loopback test capabilities for communication interfaces
4. Include status LEDs for visual verification
5. Create accessible probe points for debugging

Establish a Progressive Testing Protocol

Develop a structured approach to testing that catches issues at the earliest possible stage:

1. First Article Inspection (FAI): Thoroughly inspect and test the first boards from production before approving the full run
2. In-Circuit Testing (ICT): Verify component placement, values, and basic functionality
3. Functional Testing: Confirm the board performs its intended functions under various conditions
4. Burn-in Testing: Subject a sample of boards to extended operation to identify early-life failures
5. Environmental Stress Screening: Test under temperature extremes, humidity, and vibration to expose potential weaknesses

Document Test Results and Establish Baselines

Create a testing knowledge base for future reference:

1. Record detailed test results for each board revision
2. Document any failures and their root causes
3. Establish performance baselines for comparative evaluation
4. Track yield rates to identify potential manufacturing issues

Case Study: The Value of Comprehensive Testing

A medical device manufacturer developed a new patient monitoring system with complex PCBs containing high-speed digital and sensitive analog sections. Their initial approach included basic DRC checks and functional testing of prototypes, which seemed to work well in the lab environment.

After approving production and manufacturing 5,000 units, they discovered that approximately 15% of the boards exhibited intermittent failures when deployed in hospital settings. Investigation revealed several issues that proper testing would have identified:

1. Signal integrity problems on critical high-speed traces that only manifested under certain temperature conditions
2. Power supply noise affecting analog sensor readings
3. Insufficient clearance between certain components that led to mechanical stress during assembly

The company implemented a comprehensive testing strategy for subsequent revisions:

• Pre-production signal and power integrity simulation
• Thermal analysis under various operating conditions
• Automated optical inspection during manufacturing
• 100% in-circuit testing of all boards
• Environmental stress screening of production samples
• 24-hour burn-in testing before final acceptance

This approach increased their up-front engineering and testing costs by approximately $25,000 per product but reduced field failures by 95% and saved an estimated $350,000 in warranty claims and support costs in the first year alone.

Neglecting Supply Chain and Logistics Planning

The fifth critical mistake in PCB ordering involves inadequate attention to supply chain considerations and logistics planning. Even perfectly designed and manufactured PCBs can become problematic if you can't get them when and where you need them, or if they arrive without the components necessary for assembly.

Supply Chain Vulnerabilities

The PCB manufacturing ecosystem involves multiple interdependent suppliers and processes, creating numerous potential failure points:

Key Supply Chain Elements and Risks

Supply Chain Element
Common Vulnerabilities
Potential Impact
Raw Materials
Material shortages, obsolescence
Production delays, forced redesigns
Component Availability
Lead time variations, allocations, EOL
Assembly delays, BOM changes
Fabrication Capacity
Facility utilization fluctuations
Delivery delays, rush charges
Shipping Logistics
Customs delays, transit damage
Schedule disruptions, quality issues
Assembly Capacity
Labor or equipment constraints
Missed market windows, revenue loss

Common Supply Chain Planning Mistakes

Many organizations make critical errors in how they approach PCB supply chain management:

Material and Component Planning Errors

1. Ignoring Component Lead Times: Failing to account for long-lead components (which can exceed 52 weeks during shortages) when scheduling PCB fabrication.
2. Single-Source Dependencies: Relying on a single supplier for critical components or materials creates vulnerability to disruptions.
3. No Alternative Part Strategy: Lacking pre-approved alternative components when primary choices become unavailable.
4. Disregarding Minimum Order Quantities (MOQs): Not accounting for supplier MOQs in planning, resulting in excess inventory or unexpected costs.

Fabrication and Assembly Planning Oversights

1. Unrealistic Timeline Expectations: Demanding expedited service without understanding the actual time requirements for quality manufacturing.
2. Inadequate Capacity Planning: Failing to secure manufacturing capacity in advance for high-volume or seasonal production needs.
3. Poor Packaging Specifications: Not defining appropriate packaging requirements for transit protection and inventory management.
4. Ignoring Regional Holidays and Production Downtime: Failing to account for manufacturing shutdowns during major holidays or maintenance periods.

Effective Supply Chain and Logistics Strategies

To mitigate supply chain risks and ensure smooth PCB procurement:

Implement Strategic Component Management

Proactively manage your component supply chain:

1. Conduct regular lifecycle analysis of all BOM components
2. Identify long-lead items early in the design process
3. Maintain an approved alternates list for critical components
4. Consider component availability during component selection
5. Establish relationships with multiple distributors to improve sourcing options

Develop Multi-Source Manufacturing Capability

Reduce dependency on any single manufacturer:

1. Qualify multiple PCB fabricators with compatible capabilities
2. Standardize design rules to work across multiple manufacturers
3. Maintain consistent documentation formats that all suppliers can use
4. Balance orders across suppliers to maintain relationships
5. Develop regional sourcing options to mitigate geographic risks

Create Realistic Production Timelines

Build schedules that reflect actual manufacturing realities:

Manufacturing Stage
Typical Timeframe
Planning Considerations
Design Finalization
1-4 weeks
Component availability research, DFM review
Component Procurement
1-52+ weeks
Lead time verification, alternative sourcing
PCB Fabrication
1-3 weeks
Layer count, special processes, testing requirements
PCB Assembly
1-3 weeks
Component availability, assembly complexity
Testing
1-2 weeks
Test development, equipment availability
Shipping & Logistics
1-4 weeks
Customs clearance, transportation mode

Optimize Inventory and Logistics Management

Balance inventory costs with availability needs:

1. Implement demand forecasting to anticipate PCB requirements
2. Consider consignment inventory arrangements for critical components
3. Develop appropriate safety stock policies based on lead times and criticality
4. Specify packaging requirements that protect boards and facilitate handling
5. Plan for appropriate shipping methods based on value, urgency, and environmental sensitivity

Real-World Example: Supply Chain Resilience

A telecommunications equipment manufacturer learned valuable supply chain lessons during a major component shortage. Their flagship product contained a specialized microcontroller that suddenly went on allocation with a 38-week lead time. The company had several PCB orders in various stages of production that were affected:

• 5,000 boards already in fabrication without components
• 15,000 boards scheduled for production in the following quarter
• 30,000 boards planned for the remainder of the year

Their initial crisis response included:

1. Searching the broker market at premium prices (300-500% markup)
2. Expediting validation of an alternative microcontroller
3. Redesigning boards to accommodate the new component
4. Renegotiating delivery commitments with customers

The total impact exceeded $3 million in additional costs and lost revenue.

After this experience, they implemented a comprehensive supply chain strategy:

• Creation of a critical components database with lead time monitoring
• Pre-validation of alternate components for all single-source parts
• Development of relationships with three PCB manufacturers across different regions
• Implementation of quarterly supply chain risk assessments
• Establishment of buffer inventory policies for critical components

When another component shortage occurred two years later, they were able to seamlessly switch to alternate components and maintain production with minimal disruption, demonstrating the value of proper supply chain planning.

Frequently Asked Questions

What is the most costly mistake when ordering PCBs?

Answer: While all five mistakes discussed in this article can be expensive, incomplete or inaccurate design specifications typically lead to the most significant costs and delays. When fundamental specifications are incorrect, it often necessitates complete redesign and remanufacturing, effectively doubling your costs and timeframe. Additionally, specification errors can lead to field failures if undetected, potentially damaging your reputation and triggering expensive recalls.

How far in advance should I place my PCB order?

Answer: The optimal lead time for PCB orders depends on several factors:

• Complexity: Simple 2-layer boards might require 1-2 weeks, while complex multilayer boards with special requirements can take 3-6 weeks.
• Component availability: If your design includes long-lead components, you may need to order those 6-52 weeks in advance.
• Quantity: Larger orders generally require more production time.
• Special requirements: Controlled impedance, unusual materials, or tight tolerances may extend lead times.

As a general rule, start planning your PCB procurement at least 4-8 weeks before your target delivery date, and add additional buffer time for high-complexity or high-volume orders.

Should I use turnkey PCB assembly or manage fabrication and assembly separately?

Answer: Each approach has advantages:

Turnkey (single supplier handles fabrication and assembly):

• Simplified vendor management
• Potential for better coordination between fabrication and assembly
• Single point of responsibility for quality issues
• Often more efficient for medium to high volumes

Separate fabrication and assembly:

• May provide cost advantages for certain projects
• Allows selection of specialists for each process
• Can provide more flexibility for quick-turn prototypes
• Better control over each process
• Might be preferable when using consigned components

The best choice depends on your specific project requirements, expertise, and resources. Many organizations use both approaches, choosing turnkey for production runs and separate services for prototyping or specialized designs.

How can I ensure my PCB design is manufacturable before ordering?

Answer: To verify manufacturability before ordering:

1. Run comprehensive DFM checks using your PCB design software's built-in tools
2. Submit designs for manufacturer DFM review before finalizing orders
3. Create and follow design rules that align with manufacturer capabilities
4. Generate and verify manufacturing files using Gerber viewers and comparison tools
5. Consider ordering a small prototype run before committing to large quantities

Most reputable PCB manufacturers offer DFM review services, sometimes at no additional charge, which can identify potential issues before production begins.

What information should I always include with my PCB order?

Answer: A complete PCB order should always include:

1. Complete Gerber files (all copper layers, soldermask, silkscreen, etc.)
2. Drill files with sizes and locations clearly defined
3. Board specifications including dimensions, material, thickness, copper weight
4. Surface finish requirements (ENIG, HASL, etc.)
5. Solder mask and silkscreen colors
6. Special instructions regarding impedance control, testing requirements, etc.
7. Quantity required and delivery timeline
8. Contact information for technical questions

For assembly orders, also include:

• Bill of Materials (BOM) with manufacturer part numbers
• Pick and place files
• Assembly drawings showing component orientation
• Any special assembly instructions

Providing complete information up front prevents delays caused by back-and-forth clarification requests.

Conclusion

Avoiding these five critical mistakes when placing PCB orders—incomplete specifications, overlooking manufacturing capabilities, poor file preparation, inadequate testing, and neglecting supply chain planning—can significantly improve your electronics development process. By implementing the strategies outlined in this guide, you'll reduce costs, accelerate time-to-market, and improve product quality.

Remember that PCB procurement is not merely a purchasing function but an integral part of the product development process that deserves careful attention and systematic management. The time invested in proper preparation and planning will pay dividends in smoother production, fewer revisions, and ultimately more successful electronic products.

Whether you're ordering a simple prototype or planning high-volume production, these principles apply across all scales of PCB procurement. By learning from these common mistakes and implementing preventive measures, you'll gain a competitive advantage through more efficient and reliable PCB manufacturing.