How to Export Gerber Files From DipTrace Software

 

Introduction

Exporting Gerber files from DipTrace is a crucial step in the PCB manufacturing process. This comprehensive guide will walk you through every aspect of generating accurate and manufacturer-ready Gerber files using DipTrace software, ensuring your PCB designs can be successfully manufactured.

Understanding Gerber Files

What Are Gerber Files?

Gerber files are the standard format used in the PCB industry to communicate design information to manufacturers. They contain specific data for each layer of your PCB design.

Essential Gerber File Types

File Extension
Layer Type
Description
.GTL
Top Layer
Contains top copper traces and pads
.GBL
Bottom Layer
Contains bottom copper traces and pads
.GTS
Top Solder Mask
Defines areas where solder mask is removed
.GBS
Bottom Solder Mask
Defines bottom solder mask openings
.GTO
Top Overlay
Contains silkscreen information
.GBO
Bottom Overlay
Contains bottom silkscreen information
.GTP
Top Paste
Defines areas for solder paste application
.GBP
Bottom Paste
Defines bottom solder paste areas
.GKO
Board Outline
Defines the PCB edge cuts
.XLN/.TXT
Drill File
Contains drilling information

Preparing Your PCB Design

Design Rule Check

Before exporting Gerber files, ensure your design meets all manufacturing requirements:

Check Category
Parameters to Verify
Typical Values
Trace Width
Minimum trace width
≥ 0.15mm
Trace Spacing
Minimum spacing
≥ 0.15mm
Via Size
Minimum via diameter
≥ 0.3mm
Board Outline
Edge clearance
≥ 0.3mm
Text Size
Minimum text height
≥ 1mm

Layer Stack Configuration

Layer
Standard Stack-up
Purpose
Top Overlay
First
Component markings
Top Paste
Second
Solder paste stencil
Top Solder Mask
Third
Solder mask layer
Top Copper
Fourth
Top electrical layer
Core Material
Middle
Substrate
Bottom Copper
Fourth from bottom
Bottom electrical layer
Bottom Solder Mask
Third from bottom
Bottom solder mask
Bottom Paste
Second from bottom
Bottom paste stencil
Bottom Overlay
Last
Bottom markings

DipTrace Gerber Export Process

Basic Export Steps

1. File Preparation
   • Save your PCB design
   • Run final DRC check
   • Verify layer visibility
   • Check component placement
2. Export Settings Configuration
   • Open Export Production Files dialog
   • Select output directory
   • Configure layer mapping
   • Set export parameters

Export Parameters Configuration

Parameter
Recommended Setting
Description
Units
MM
Metric units for consistency
Format
4:4
Four digits before and after decimal
Zeros
Leading
Keep leading zeros
Encoding
ASCII
Standard text encoding
Extension
.ger
Standard Gerber extension

Layer Configuration

Essential Layer Settings

Layer Type
Export Options
Notes
Copper Layers
Pads, Traces, Fills
Include all copper elements
Solder Mask
Inverse, Pads only
Check pad clearances
Silkscreen
Text, Components
Verify text readability
Paste Mask
Component pads
Check stencil requirements
Drill File
Plated, Non-plated
Separate drill files

Advanced Layer Options

Copper Layer Settings

Setting
Purpose
Default Value
Thermal Relief
Pad connection
Enabled
Clearance
Copper spacing
0.2mm
Min Width
Trace width
0.15mm
Polygon Pour
Fill type
Solid

Advanced Export Settings

Aperture Configuration

Aperture Type
Usage
Configuration
Round
Vias, round pads
Auto-generated
Rectangle
Square pads
Auto-generated
Oblong
Elongated pads
Custom defined
Custom
Special shapes
User defined

Drill File Configuration

Parameter
Setting
Description
Format
Excellon
Industry standard
Units
Metric
MM specification
Zeros
Leading
Include leading zeros
Tool Range
0.2mm - 6.5mm
Common drill sizes

Verification and Validation

Pre-Export Checklist

Check Item
Verification Method
Common Issues
Layer Stack
Visual inspection
Missing layers
Drill Sizes
Size verification
Invalid sizes
Board Outline
Continuous path
Gaps in outline
Component Clearance
DRC check
Spacing violations
Text Legibility
Visual review
Undersized text

Post-Export Verification

1. File Completeness Check
   • Verify all required files are generated
   • Check file sizes are reasonable
   • Confirm file extensions are correct
2. Gerber Viewer Inspection
   • Load files in viewer
   • Check layer alignment
   • Verify drill positions
   • Confirm board dimensions

Troubleshooting Common Issues

Export Errors

Error Type
Possible Cause
Solution
Missing Layers
Incorrect configuration
Review layer settings
Invalid Format
Wrong export parameters
Check format settings
Incomplete Files
Process interruption
Re-export files
Size Mismatch
Unit configuration
Verify unit settings

File Validation Issues

Issue
Symptom
Resolution
Misaligned Layers
Visual offset
Check origin point
Missing Features
Incomplete output
Review export settings
Drill Mismatch
Incorrect positions
Verify drill file format
Scale Problems
Wrong dimensions
Check unit configuration

Best Practices

File Organization

Category
Recommendation
Purpose
File Naming
Consistent convention
Easy identification
Folder Structure
Organized hierarchy
Better management
Version Control
Revision numbering
Track changes
Backup
Multiple locations
Data protection

Quality Assurance Steps

1. Pre-Export Preparation
   • Complete design review
   • Run final DRC
   • Check layer visibility
   • Verify component placement
2. Export Process
   • Use consistent settings
   • Maintain organized structure
   • Document special requirements
   • Verify output files

Manufacturing Considerations

Manufacturer Requirements

Requirement
Typical Specification
Notes
File Format
RS-274X
Modern Gerber
Drill Format
Excellon
Industry standard
Layer Names
Clear identification
Standardized naming
Archive Format
ZIP
Compressed package

Production-Ready Package

File Type
Purpose
Required
Gerber Files
Layer data
Yes
Drill Files
Hole information
Yes
README
Special instructions
Recommended
Drawing
Board dimensions
Recommended

Frequently Asked Questions

Q1: What is the correct layer sequence for exporting Gerber files in DipTrace?

A1: The recommended layer sequence is: Top Overlay, Top Paste, Top Solder Mask, Top Copper, Internal Layers (if any), Bottom Copper, Bottom Solder Mask, Bottom Paste, and Bottom Overlay. Drill files should be exported separately in Excellon format.

Q2: How do I verify my Gerber files are correct before sending them to manufacturing?

A2: After export, use a Gerber viewer to check: layer alignment, presence of all required layers, correct board dimensions, proper drill hole locations, and component placement. Also verify that copper layers, solder mask, and silkscreen align properly.

Q3: What are the most common export settings mistakes in DipTrace?

A3: Common mistakes include incorrect units (metric vs. imperial), wrong number format (leading vs. trailing zeros), improper layer selection, and forgotten drill files. Always verify these settings before export and use the recommended 4:4 format with leading zeros.

Q4: Why are some features missing in my exported Gerber files?

A4: Missing features usually result from incorrect layer visibility settings, improper export configuration, or features being on disabled layers. Ensure all relevant layers are visible and properly configured in the export settings dialog.

Q5: How do I handle different drill sizes in DipTrace Gerber export?

A5: DipTrace automatically generates a drill file with all hole sizes. Ensure you export both plated and non-plated holes if your design requires them. The drill file should be in Excellon format with metric units for consistency.

The Impact of Poor Insertion on Solder Mask for PCB Through-hole Copper and Its Solutions

 

Introduction

Poor insertion practices in printed circuit board (PCB) manufacturing can significantly impact the integrity of solder masks and through-hole copper plating. This comprehensive analysis explores the various effects of improper insertion techniques, their consequences on PCB reliability, and detailed solutions to prevent and address these issues. Understanding these impacts is crucial for maintaining high-quality PCB production and ensuring long-term product reliability.

Understanding Through-hole Technology and Solder Mask

Fundamentals of Through-hole Technology

Basic Components and Structure

Component
Function
Typical Specifications
Through-hole
Component mounting and electrical connection
Diameter: 0.3mm - 6mm
Copper Plating
Electrical conductivity
Thickness: 25µm - 35µm
Solder Mask
Protection and insulation
Thickness: 10µm - 25µm

Solder Mask Properties

Property
Specification
Importance
Adhesion
>10N/mm²
Prevents delamination
Hardness
6H-8H
Resists mechanical damage
Thickness Tolerance
±2µm
Ensures consistent coverage
Heat Resistance
Up to 288°C
Withstands soldering

Impact of Poor Insertion Practices

Mechanical Damage

Types of Mechanical Damage

Damage Type
Cause
Impact Severity
Cracking
Excessive force
High
Delamination
Poor alignment
Medium-High
Scratching
Rough handling
Medium
Chipping
Impact damage
High

Copper Plating Issues

Common Plating Defects

Defect
Description
Prevention Method
Void Formation
Air pockets in plating
Proper chemical balance
Thickness Variation
Uneven distribution
Control current density
Poor Adhesion
Weak bonding
Surface preparation
Nodulation
Irregular growth
Filter contamination

Quality Control Methods

Inspection Techniques

Technique
Detection Capability
Implementation Cost
Visual Inspection
Surface defects
Low
Microsection Analysis
Internal structure
High
X-ray Inspection
Hidden defects
Very High
Electrical Testing
Connectivity issues
Medium

Measurement Standards

Parameter
Standard Range
Measurement Method
Hole Diameter
±0.1mm
Optical measurement
Plating Thickness
±5µm
Cross-section analysis
Surface Roughness
Ra 0.2-0.8µm
Profilometer
Pull Strength
>10N
Pull testing

Prevention Strategies

Process Controls

Manufacturing Parameters

Parameter
Optimal Range
Control Method
Insertion Force
20-50N
Force monitoring
Alignment
±0.1mm
Optical guidance
Speed
1-3 m/min
Automated control
Temperature
20-25°C
Environmental control

Equipment Maintenance

Maintenance Task
Frequency
Impact on Quality
Tool Calibration
Weekly
High
Cleaning
Daily
Medium
Wear Inspection
Monthly
High
Parameter Verification
Daily
Medium

Solutions and Remediation

Immediate Solutions

Emergency Repairs

Issue
Solution
Success Rate
Mask Damage
Local repair
80%
Copper Break
Re-plating
70%
Delamination
Adhesive repair
60%
Surface Contamination
Chemical cleaning
90%

Long-term Improvements

Improvement
Implementation Time
ROI Period
Automated Insertion
3-6 months
12 months
Training Program
1-2 months
6 months
Quality System
6-12 months
18 months
Tool Upgrade
2-3 months
9 months

Advanced Manufacturing Techniques

Modern Insertion Methods

Method
Accuracy
Cost Efficiency
Robotic Insertion
±0.05mm
High
Semi-automated
±0.1mm
Medium
Manual with Guides
±0.2mm
Low
Fully Automated
±0.02mm
Very High

Process Optimization

Key Parameters

Parameter
Target Range
Control Method
Insertion Angle
90° ±1°
Optical sensing
Force Control
±5%
Load cell monitoring
Speed Control
±2%
Servo feedback
Position Accuracy
±0.1mm
Vision system

Cost Analysis

Impact of Poor Insertion

Cost Category
Annual Impact
Prevention Cost
Rework
$50,000-100,000
$15,000-25,000
Scrap
$25,000-50,000
$10,000-20,000
Quality Control
$30,000-60,000
$20,000-40,000
Customer Returns
$40,000-80,000
$25,000-45,000

Investment in Solutions

Solution Type
Initial Cost
Annual Savings
Equipment
$100,000-200,000
$50,000-100,000
Training
$20,000-40,000
$30,000-60,000
Process Control
$50,000-100,000
$40,000-80,000
Maintenance
$30,000-60,000
$35,000-70,000

Future Trends and Developments

Emerging Technologies

Technology
Implementation Timeline
Expected Impact
AI-guided Insertion
2-3 years
High
Smart Monitoring
1-2 years
Medium
IoT Integration
1-3 years
High
Predictive Analytics
2-4 years
Very High

Frequently Asked Questions

Q1: What are the most common signs of poor insertion damage to solder mask?

A: The most common indicators include:

• Circular cracks around the through-hole
• Delamination of the solder mask
• White rings or stress marks
• Surface scratches or gouges These typically appear immediately after insertion and can worsen over time if not addressed.

Q2: How does poor insertion affect the long-term reliability of PCBs?

A: Poor insertion can lead to several long-term issues:

• Reduced electrical connectivity
• Increased susceptibility to environmental damage
• Higher failure rates during thermal cycling
• Compromised structural integrity Regular inspection and maintenance are essential to prevent these issues.

Q3: What are the most effective immediate solutions for damaged through-holes?

A: The most effective immediate solutions include:

• Professional repair using specialized epoxy
• Re-plating of damaged copper surfaces
• Local solder mask reapplication
• Mechanical cleaning and surface preparation The choice of solution depends on the severity and type of damage.

Q4: How can manufacturers prevent insertion damage during high-volume production?

A: Key prevention strategies include:

• Implementing automated insertion systems
• Regular tool maintenance and calibration
• Comprehensive operator training
• Real-time process monitoring
• Quality control checkpoints

Q5: What role does proper tool selection play in preventing insertion damage?

A: Tool selection is crucial for preventing damage:

• Tools must match hole specifications
• Regular tool wear monitoring is essential
• Proper material selection for tools
• Correct tool geometry for specific applications Tools should be regularly inspected and replaced as needed.

Conclusion

The impact of poor insertion practices on PCB through-hole copper and solder mask can be significant, leading to both immediate and long-term reliability issues. By implementing proper prevention strategies, utilizing advanced manufacturing techniques, and maintaining stringent quality control measures, manufacturers can minimize these impacts and ensure high-quality PCB production. Continuous monitoring, regular maintenance, and investment in modern technologies are essential for maintaining optimal production standards and preventing insertion-related defects.